| 1. |
EXECUTIVE SUMMARY |
| 1.1. |
What is the report about and who should read it |
| 1.2. |
Existing large mini-/micro-LED display announcements |
| 1.3. |
Expectation of future displays |
| 1.4. |
Status of OLED |
| 1.5. |
Strategies of QDs in display |
| 1.6. |
Characteristic comparison of different display technologies |
| 1.7. |
Horizontal comparison |
| 1.8. |
Why Micro-LED Displays? |
| 1.9. |
Micro-LED value propositions compared with LCD, OLED, QD |
| 1.10. |
Importance of identifying core value propositions |
| 1.11. |
Core value propositions of µLED displays 1 |
| 1.12. |
Core value propositions of µLED displays 2 |
| 1.13. |
Core value propositions of µLED displays 3 |
| 1.14. |
Core value propositions of µLED displays 4 |
| 1.15. |
Core value propositions of µLED displays 5 |
| 1.16. |
Analysis of micro-LED’s value propositions |
| 1.17. |
Influence of resolution for applications |
| 1.18. |
Micro-LED display types |
| 1.19. |
Potential applications for micro-LED displays |
| 1.20. |
Matrix analysis |
| 1.21. |
Display requirements for XR applications |
| 1.22. |
Application analysis: Augmented/mixed reality |
| 1.23. |
Application analysis: Virtual reality |
| 1.24. |
Application analysis: Large video displays |
| 1.25. |
Application analysis: Televisions and monitors |
| 1.26. |
Application analysis: Automotive displays |
| 1.27. |
Application analysis: Mobile phones |
| 1.28. |
Application analysis: Smart watches and wearables |
| 1.29. |
Application analysis: Tablets and laptop |
| 1.30. |
Emerging displays enabled by micro-LED technology |
| 1.31. |
Micro-LED display development stage |
| 1.32. |
Micro-LED application roadmap |
| 1.33. |
Micro-LED display fabrication flowchart |
| 1.34. |
Technologies of micro-LED displays |
| 1.35. |
Complex micro-LED display design |
| 1.36. |
Challenge transition for micro-display manufacturing |
| 1.37. |
Current achievements of micro-LED displays |
| 1.38. |
Summary of challenges for micro-LED displays |
| 1.39. |
Issues with RGB micro-LED chips |
| 1.40. |
Micro-LED performance summary |
| 1.41. |
Full colour realization |
| 1.42. |
Quantum dots for µLEDs |
| 1.43. |
Regional development: Taiwan |
| 1.44. |
Regional development: Mainland China |
| 1.45. |
Regional development: Japan & Korea |
| 1.46. |
Regional development: Europe |
| 1.47. |
Regional development: US |
| 1.48. |
Supply chain status |
| 1.49. |
Supply chain reshuffle |
| 1.50. |
Possible supply chain for micro-LED displays |
| 1.51. |
Scenarios of supply chain dominance |
| 1.52. |
Supply chain influenced by trade war and coronavirus |
| 2. |
INTRODUCTION TO MICRO-LED DISPLAY |
| 2.1. |
From traditional LEDs… |
| 2.2. |
…to Micro-LEDs |
| 2.3. |
Comparisons of LEDs for displays |
| 2.4. |
Mini-LEDs and Micro-LEDs |
| 2.5. |
Correlations between mini-LED, micro-LED and fine pitch LED displays |
| 2.6. |
From traditional LEDs to micro-LED |
| 2.7. |
Display types based on micro-LEDs |
| 2.8. |
Advantages of AM micro-LED micro-displays |
| 2.9. |
LED size definitions |
| 2.10. |
Micro-LED displays: size is an important feature |
| 2.11. |
Micro LED displays: beyond the size |
| 2.12. |
A better definition? |
| 2.13. |
Micro-LED display panel structure |
| 3. |
EPITAXY AND CHIP MANUFACTURING |
| 3.1. |
Introduction to light-emitting diodes |
| 3.1.1. |
History of solid-state lighting |
| 3.1.2. |
What is an LED? |
| 3.1.3. |
How does an LED work? |
| 3.1.4. |
Homojunction vs. heterojunction |
| 3.1.5. |
LEDs by package technique 1 |
| 3.1.6. |
LEDs by package technique 2 |
| 3.1.7. |
Typical LED and packaged LED sizes |
| 3.1.8. |
Comparison between SMD and COB |
| 3.1.9. |
COB for displays |
| 3.1.10. |
List of global major LED companies with introduction |
| 3.2. |
Epitaxy |
| 3.2.1. |
Bandgap vs. lattice constant for III-V semiconductors |
| 3.2.2. |
Materials for commercial LED chips 1 |
| 3.2.3. |
Materials for commercial LED chips 2 |
| 3.2.4. |
Green gap |
| 3.2.5. |
Epitaxy substrate |
| 3.2.6. |
Wafer patterning 1 |
| 3.2.7. |
Wafer patterning 2 |
| 3.2.8. |
Wafer patterning 3 |
| 3.2.9. |
Epitaxy methods |
| 3.2.10. |
Metal organic chemical vapor deposition |
| 3.2.11. |
Pros and cons of MOCVD |
| 3.2.12. |
Epitaxial growth requirement |
| 3.2.13. |
Offering from Aixtron and Veeco |
| 3.2.14. |
Veeco’s offering |
| 3.2.15. |
Engineered substrate |
| 3.2.16. |
Wafer uniformity 1 |
| 3.2.17. |
Wavelength uniformity 2 |
| 3.2.18. |
Solutions for wafer nonuniformity |
| 3.3. |
Chip manufacturing |
| 3.3.1. |
LED fabrication flowchart |
| 3.3.2. |
Typical RGB LED designs |
| 3.3.3. |
LED chip structures 1 |
| 3.3.4. |
LED chip structures 2 |
| 3.3.5. |
LED chip structure illustrations |
| 3.3.6. |
Future of the LED chip structure |
| 3.3.7. |
Epi-film transfer |
| 3.3.8. |
Fabrication of vertical GaN-LEDs |
| 3.4. |
Micro-LED Performances |
| 3.4.1. |
Influence of micro-LED performance |
| 3.4.2. |
EQE of micro-LED versus current density 1 |
| 3.4.3. |
EQE of micro-LED versus current density 2 |
| 3.4.4. |
Efficiency droop |
| 3.4.5. |
Temperature stability |
| 3.4.6. |
Bowing of wavelength shift |
| 3.4.7. |
Size dependence of micro-LEDs 1 |
| 3.4.8. |
Size dependence of micro-LEDs 2 |
| 3.4.9. |
Size dependence of micro-LEDs 3 |
| 3.4.10. |
Size dependence of micro-LEDs 4 |
| 3.4.11. |
Efficiencies and requirement of RGB micro-LEDs |
| 3.4.12. |
Surface recombination |
| 3.4.13. |
Sidewall effect |
| 3.4.14. |
Side wall passivation |
| 3.4.15. |
Efficiency improvement |
| 4. |
TRANSFER AND ASSEMBLY |
| 4.1.1. |
Introduction |
| 4.1.2. |
Mass transfer and assembly technologies |
| 4.1.3. |
Requirements of mass transfer |
| 4.1.4. |
Chiplet mass transfer types |
| 4.2. |
Chiplet Mass Transfer |
| 4.2.1. |
Introduction to chiplet mass assembly |
| 4.2.2. |
Chiplet mass transfer scenario 1 |
| 4.2.3. |
Chiplet mass transfer scenario 2 |
| 4.2.4. |
Comparison of mass transfer technologies |
| 4.2.5. |
Comparison of transfer technologies of different companies |
| 4.2.6. |
Transfer yield |
| 4.2.7. |
Fine pick and place |
| 4.2.8. |
Overview of Elastomeric stamp |
| 4.2.9. |
Transfer process flow |
| 4.2.10. |
Elastomeric stamp: pros and cons |
| 4.2.11. |
Stamp yield vs. defect density |
| 4.2.12. |
Key technologies for micro-LED mass transfer |
| 4.2.13. |
Substrate treatment |
| 4.2.14. |
Kinetic control of the elastomeric stamp adhesion |
| 4.2.15. |
Elastomeric stamp |
| 4.2.16. |
Pitch size determination |
| 4.2.17. |
X-Celeprint |
| 4.2.18. |
µLED fabrication |
| 4.2.19. |
µLEDs from sapphire substrate |
| 4.2.20. |
Passive matrix displays made by micro-transfer printing |
| 4.2.21. |
Passive matrix μLED display fabrication 1 |
| 4.2.22. |
Passive matrix μLED display fabrication 2 |
| 4.2.23. |
Active matrix displays made by micro-transfer printing |
| 4.2.24. |
Active matrix μLED display fabrication |
| 4.2.25. |
Automated micro-transfer printing machinery |
| 4.2.26. |
Capillary-assisted transfer printing |
| 4.2.27. |
Mikro Mesa: Transfer technology |
| 4.2.28. |
Mikro Mesa: Transfer flowchart 1 |
| 4.2.29. |
Mikro Mesa: Transfer flowchart 2 |
| 4.2.30. |
Mikro Mesa: Transfer stamp |
| 4.2.31. |
Mikro Mesa: Transfer design target |
| 4.2.32. |
PlayNitride: Mass transfer for micro-LED chips |
| 4.2.33. |
PlayNitride: Mass transfer flowchart 1 |
| 4.2.34. |
PlayNitride: Mass transfer flowchart 2 |
| 4.2.35. |
Visionox 1 |
| 4.2.36. |
Visionox 2 |
| 4.2.37. |
ITRI: Chip fabrication |
| 4.2.38. |
ITRI’s mass transfer process |
| 4.2.39. |
ITRI’s transfer module |
| 4.2.40. |
Overview of electrostatic array |
| 4.2.41. |
Electrostatic/electromagnetic transfer |
| 4.2.42. |
Apple/LuxVue 1 |
| 4.2.43. |
Apple/LuxVue 2 |
| 4.2.44. |
VerLASE’s large area assembly platform |
| 4.2.45. |
Interposer idea |
| 4.2.46. |
Self assembly |
| 4.2.47. |
introduction of fluidic-assembly |
| 4.2.48. |
eLux: introduction |
| 4.2.49. |
Fabrication of micro-LED chip array |
| 4.2.50. |
eLux’s fluidic assembly |
| 4.2.51. |
eLux’s display prototypes |
| 4.2.52. |
eLux’s supply chain |
| 4.2.53. |
eLux’s core patent technology 1 |
| 4.2.54. |
eLux’s core patent technology 2 |
| 4.2.55. |
eLux’s core patent technology 3 |
| 4.2.56. |
eLux’s core patent technology 4 |
| 4.2.57. |
eLux’s core patent technology 5 |
| 4.2.58. |
eLux’s core patent technology 6 |
| 4.2.59. |
Image quality comparison |
| 4.2.60. |
SWOT analysis of eLux’s technology |
| 4.2.61. |
Other fluidic assembly techniques |
| 4.2.62. |
Fluidic assembly (physical): overview |
| 4.2.63. |
Alien |
| 4.2.64. |
Alien’s fluidic self assembly technology |
| 4.2.65. |
Self-assembly based on shape/geometry matching |
| 4.2.66. |
Shape-based self assembly |
| 4.2.67. |
Fluidic assembly (electrophoretic): overview |
| 4.2.68. |
Electrophoretic positioning of LEDs |
| 4.2.69. |
PARC’s xerographic micro-assembly Printing 1 |
| 4.2.70. |
PARC’s xerographic micro-assembly Printing 2 |
| 4.2.71. |
Fluidic-assembly (surface energy): overview |
| 4.2.72. |
Mechanism of surface-tension-driven fluidic assembly |
| 4.2.73. |
Surface tension based fluidic assembly 1 |
| 4.2.74. |
Surface tension based fluidic assembly 2 |
| 4.2.75. |
Surface tension based fluidic assembly 3 |
| 4.2.76. |
Surface tension based fluidic assembly 4 |
| 4.2.77. |
Fluidic-assembly (magnetic): overview |
| 4.2.78. |
Magnetically-assisted assembly |
| 4.2.79. |
Fluidic-assembly (photoelectrochemical): overview |
| 4.2.80. |
Photoelectrochemically driven fluidic-assembly |
| 4.2.81. |
Fluidic-assembly (combination): overview |
| 4.2.82. |
Chip mounting apparatus |
| 4.2.83. |
Summary of fluidic assembly |
| 4.2.84. |
SelfArray |
| 4.2.85. |
Laser enabled transfer |
| 4.2.86. |
Overview of laser enabled transfer |
| 4.2.87. |
Laser beam requirement |
| 4.2.88. |
Coherent UVtransfer 3in1 System |
| 4.2.89. |
Uniqarta’s parallel laser-enabled transfer technology 1 |
| 4.2.90. |
Uniqarta’s parallel laser-enabled transfer technology 2 |
| 4.2.91. |
Uniqarta’s parallel laser-enabled transfer technology 3 |
| 4.2.92. |
Uniqarta’s parallel laser-enabled transfer technology 4 |
| 4.2.93. |
Uniqarta’s parallel laser-enabled transfer technology 5 |
| 4.2.94. |
QMAT’s beam-addressed release technology |
| 4.2.95. |
Optovate’s technology 1 |
| 4.2.96. |
Optovate’s technology 2 |
| 4.2.97. |
Coherent’s approach |
| 4.2.98. |
Toray’s offering |
| 4.2.99. |
Visionox’s achievement |
| 4.2.100. |
Other chiplet mass transfer techniques |
| 4.2.101. |
Korean Institute of Machinery and Materials (KIMM) 1 |
| 4.2.102. |
Korean Institute of Machinery and Materials (KIMM) 2 |
| 4.2.103. |
VueReal’s cartridge printing technique |
| 4.2.104. |
VueReal’s micro printer |
| 4.2.105. |
Innovasonic’s technology |
| 4.2.106. |
Rohinni’s technology |
| 4.2.107. |
Two-step micro-transfer technology 1 |
| 4.2.108. |
Two-step micro-transfer technology 2 |
| 4.2.109. |
Two-step micro-transfer technology 3 |
| 4.2.110. |
Two-step micro-transfer technology 4 |
| 4.2.111. |
Micro-transfer using a stretchable film |
| 4.2.112. |
Micro-pick-and-place |
| 4.2.113. |
Photo-polymer mass transfer |
| 4.3. |
Monolithic Hybrid Integration |
| 4.3.1. |
Monolithic integration |
| 4.3.2. |
Flip-chip hybrid integration |
| 4.3.3. |
Wafer bonding process |
| 4.3.4. |
Monolithic hybrid integration structure |
| 4.3.5. |
Selective transfer by selective bonding-debonding |
| 4.3.6. |
Pros and cons of monolithic hybrid integration |
| 4.3.7. |
Players on monolithic hybrid integration |
| 4.4. |
All-In-One Transfer |
| 4.4.1. |
All-in-one CMOS driving |
| 4.4.2. |
Pros and cons of all-in-one CMOS driving technique |
| 4.5. |
Fully Monolithic Integration |
| 4.5.1. |
Introduction of fully monolithic integration |
| 4.5.2. |
JBD’s integration technology |
| 4.5.3. |
Lumiode approach |
| 4.5.4. |
Lumiode approach, process details |
| 4.5.5. |
Temperature performance for the crystallization |
| 4.5.6. |
Wafer from Lumiode |
| 4.5.7. |
Ostendo’s approach |
| 4.5.8. |
Ostendo’s QPI structure |
| 4.6. |
GaN on Silicon |
| 4.6.1. |
GaN-on-Si for various application markets |
| 4.6.2. |
GaN on silicon epi types |
| 4.6.3. |
Challenges of GaN-on-Silicon epitaxy |
| 4.6.4. |
Value propositions of GaN-on-Si 1 |
| 4.6.5. |
Value propositions of GaN-on-Si 2 |
| 4.6.6. |
GaN on sapphire vs. on silicon |
| 4.6.7. |
GaN-on-Si approach |
| 4.6.8. |
Cost comparison: sapphire vs silicon |
| 4.6.9. |
Is GaN-on-Si the ultimate option? |
| 4.6.10. |
Players working on GaN micro-LEDs on silicon |
| 4.7. |
Nanowires |
| 4.7.1. |
Comparison between 2D and 3D micro-LEDs |
| 4.7.2. |
GaN epitaxy on silicon substrate |
| 4.7.3. |
Aledia process flow |
| 4.7.4. |
Aledia’s nanowire technology |
| 4.7.5. |
Front size device technology |
| 4.7.6. |
Nanowires growth on silicon substrate |
| 4.7.7. |
Size influence on nanowire’s efficiency |
| 4.7.8. |
Native EL RGB nanowires |
| 4.7.9. |
3D technology for small-display applications |
| 4.7.10. |
Micro-display enabled by nanowires and 3D integration |
| 4.7.11. |
Future of nanowire approach |
| 4.8. |
Bonding and interconnection |
| 4.8.1. |
Classification |
| 4.8.2. |
Summary |
| 4.8.3. |
Wire bonding and flip chip bonding |
| 4.8.4. |
ACF bonding |
| 4.8.5. |
Interconnection by resin reflow |
| 4.8.6. |
Microtube interconnections |
| 4.8.7. |
Microtube fabrication |
| 4.8.8. |
Transfer and interconnection process by microtubes |
| 5. |
TESTING |
| 5. |
TESTING |
| 5.1. |
Testing techniques |
| 5.1. |
Testing techniques |
| 5.2. |
Challenges in inspection |
| 5.2. |
Challenges in inspection |
| 5.3. |
PL vs. EL testing |
| 5.3. |
PL vs. EL testing |
| 5.4. |
EL test by Tesoro Scientific 1 |
| 5.4. |
EL test by Tesoro Scientific 1 |
| 5.5. |
EL test by Tesoro Scientific 2 |
| 5.5. |
EL test by Tesoro Scientific 2 |
| 5.6. |
Camera-based microscopic imaging system |
| 5.6. |
Camera-based microscopic imaging system |
| 5.7. |
Inspection solution by Toray 1 |
| 5.7. |
Inspection solution by Toray 1 |
| 5.8. |
Inspection solution by Toray 2 |
| 5.8. |
Inspection solution by Toray 2 |
| 5.9. |
Instrument System’s solution |
| 5.9. |
Instrument System’s solution |
| 5.10. |
PL+AOI |
| 5.10. |
PL+AOI |
| 5.11. |
TTPCON’s solution |
| 5.11. |
TTPCON’s solution |
| 5.12. |
Cathodoluminescence used for testing |
| 5.12. |
Cathodoluminescence used for testing |
| 5.13. |
Hamamatsu Photonics’ PL testing |
| 5.13. |
Hamamatsu Photonics’ PL testing |
| 5.14. |
Trends of testing |
| 5.14. |
Trends of testing |
| 6. |
DEFECT MANAGEMENT |
| 6. |
DEFECT MANAGEMENT |
| 6.1. |
Introduction |
| 6.1. |
Introduction |
| 6.2. |
Defect types |
| 6.2. |
Defect types |
| 6.3. |
Redundancy |
| 6.3. |
Redundancy |
| 6.4. |
Repair 1 |
| 6.4. |
Repair 1 |
| 6.5. |
Repair 2 |
| 6.5. |
Repair 2 |
| 6.6. |
Laser micro trimming 1 |
| 6.6. |
Laser micro trimming 1 |
| 6.7. |
Laser micro trimming 2 |
| 6.7. |
Laser micro trimming 2 |
| 6.8. |
PlayNitride’s SMAR Tech |
| 6.8. |
PlayNitride’s SMAR Tech |
| 6.9. |
Defect compensation by QDs |
| 6.9. |
Defect compensation by QDs |
| 7. |
MICRO-LED DISPLAY FULL-COLOUR REALIZATION |
| 7. |
MICRO-LED DISPLAY FULL-COLOUR REALIZATION |
| 7.1.1. |
Strategies for full colour realization |
| 7.1.1. |
Strategies for full colour realization |
| 7.1.2. |
Direct RGB or color converters? |
| 7.1.2. |
Direct RGB or color converters? |
| 7.1.3. |
RGB micro-LEDs vs. blue micro-LED + QD 1 |
| 7.1.3. |
RGB micro-LEDs vs. blue micro-LED + QD 1 |
| 7.1.4. |
RGB micro-LEDs vs. blue micro-LED + QD 2 |
| 7.1.4. |
RGB micro-LEDs vs. blue micro-LED + QD 2 |
| 7.2. |
Colour filters |
| 7.2. |
Colour filters |
| 7.2.1. |
Colour filters |
| 7.2.1. |
Colour filters |
| 7.2.2. |
Colour filter process flow: black matrix process |
| 7.2.2. |
Colour filter process flow: black matrix process |
| 7.2.3. |
Colour filter process flow: RGB process 1 |
| 7.2.3. |
Colour filter process flow: RGB process 1 |
| 7.2.4. |
Colour filter process flow: RGB process 2 |
| 7.2.4. |
Colour filter process flow: RGB process 2 |
| 7.3. |
Optical lens synthesis |
| 7.3. |
Optical lens synthesis |
| 7.3.1. |
Full colour realized by optical lens synthesis |
| 7.3.1. |
Full colour realized by optical lens synthesis |
| 7.3.2. |
Full colour realization for projectors |
| 7.3.2. |
Full colour realization for projectors |
| 7.4. |
Do phosphors work for micro-LED displays? |
| 7.4. |
Do phosphors work for micro-LED displays? |
| 7.4.1. |
Introduction to phosphors 1 |
| 7.4.1. |
Introduction to phosphors 1 |
| 7.4.2. |
Introduction to phosphors 2 |
| 7.4.2. |
Introduction to phosphors 2 |
| 7.4.3. |
Requirements for phosphors in LEDs |
| 7.4.3. |
Requirements for phosphors in LEDs |
| 7.4.4. |
Table of phosphor materials |
| 7.4.4. |
Table of phosphor materials |
| 7.4.5. |
Search for narrow FWHM red phosphors |
| 7.4.5. |
Search for narrow FWHM red phosphors |
| 7.4.6. |
Common and emerging red-emitting phosphors |
| 7.4.6. |
Common and emerging red-emitting phosphors |
| 7.4.7. |
Red phosphor options: TriGainTM from GE |
| 7.4.7. |
Red phosphor options: TriGainTM from GE |
| 7.4.8. |
Reliability of TriGain |
| 7.4.8. |
Reliability of TriGain |
| 7.4.9. |
Commercial progress of GE’s narrowband red phosphor |
| 7.4.9. |
Commercial progress of GE’s narrowband red phosphor |
| 7.4.10. |
Small sized PFS phosphor |
| 7.4.10. |
Small sized PFS phosphor |
| 7.4.11. |
Red phosphor options: Sr[LiAl3N4]:Eu2+ (SLA) red phosphor |
| 7.4.11. |
Red phosphor options: Sr[LiAl3N4]:Eu2+ (SLA) red phosphor |
| 7.4.12. |
Thermal stability of common RGY phosphors |
| 7.4.12. |
Thermal stability of common RGY phosphors |
| 7.4.13. |
Narrow band green phosphor |
| 7.4.13. |
Narrow band green phosphor |
| 7.4.14. |
High performance organic phosphors |
| 7.4.14. |
High performance organic phosphors |
| 7.4.15. |
Toray’s organic colour conversion film |
| 7.4.15. |
Toray’s organic colour conversion film |
| 7.4.16. |
Colour coverage of Toray’s colour conversion films |
| 7.4.16. |
Colour coverage of Toray’s colour conversion films |
| 7.4.17. |
Stability of Toray’s colour conversion films |
| 7.4.17. |
Stability of Toray’s colour conversion films |
| 7.4.18. |
Response time feature of Toray’s colour conversion films |
| 7.4.18. |
Response time feature of Toray’s colour conversion films |
| 7.4.19. |
Suppliers of phosphors |
| 7.4.19. |
Suppliers of phosphors |
| 7.5. |
Quantum dot approach |
| 7.5. |
Quantum dot approach |
| 7.5.1. |
Introduction to quantum dots |
| 7.5.1. |
Introduction to quantum dots |
| 7.5.2. |
Value propositions of QDs in displays |
| 7.5.2. |
Value propositions of QDs in displays |
| 7.5.3. |
Quantum dots used for micro-LED displays |
| 7.5.3. |
Quantum dots used for micro-LED displays |
| 7.5.4. |
QDs vs. phosphors: particle size |
| 7.5.4. |
QDs vs. phosphors: particle size |
| 7.5.5. |
QDs vs. phosphors: response time |
| 7.5.5. |
QDs vs. phosphors: response time |
| 7.5.6. |
QDs vs. phosphors: colour tunability |
| 7.5.6. |
QDs vs. phosphors: colour tunability |
| 7.5.7. |
QDs vs. phosphors: stability |
| 7.5.7. |
QDs vs. phosphors: stability |
| 7.5.8. |
QDs vs. phosphors: FWHM |
| 7.5.8. |
QDs vs. phosphors: FWHM |
| 7.5.9. |
Pros and cons of QD converters |
| 7.5.9. |
Pros and cons of QD converters |
| 7.5.10. |
Basic requirements of QDs for micro-LED displays |
| 7.5.10. |
Basic requirements of QDs for micro-LED displays |
| 7.5.11. |
Trade-off between efficiency and leakage |
| 7.5.11. |
Trade-off between efficiency and leakage |
| 7.5.12. |
Efficiency drop and red shift |
| 7.5.12. |
Efficiency drop and red shift |
| 7.5.13. |
Thickness of the QD layer for absorption |
| 7.5.13. |
Thickness of the QD layer for absorption |
| 7.5.14. |
Display structure with QDs |
| 7.5.14. |
Display structure with QDs |
| 7.5.15. |
Polarizers, short-pass filters, and other additional layers? |
| 7.5.15. |
Polarizers, short-pass filters, and other additional layers? |
| 7.5.16. |
High blue absorptive QD materials |
| 7.5.16. |
High blue absorptive QD materials |
| 7.5.17. |
QD converters for µLED displays |
| 7.5.17. |
QD converters for µLED displays |
| 7.5.18. |
Inkjet printing used for colour filters |
| 7.5.18. |
Inkjet printing used for colour filters |
| 7.5.19. |
Ink-jet printed QD colour converters |
| 7.5.19. |
Ink-jet printed QD colour converters |
| 7.5.20. |
Curing methods |
| 7.5.20. |
Curing methods |
| 7.5.21. |
Inkjet printed QD 1 |
| 7.5.21. |
Inkjet printed QD 1 |
| 7.5.22. |
Inkjet printed QD 2 |
| 7.5.22. |
Inkjet printed QD 2 |
| 7.5.23. |
DIC’s work 1 |
| 7.5.23. |
DIC’s work 1 |
| 7.5.24. |
DIC’s work 2 |
| 7.5.24. |
DIC’s work 2 |
| 7.5.25. |
Photolithography process |
| 7.5.25. |
Photolithography process |
| 7.5.26. |
QD photoresist fabrication |
| 7.5.26. |
QD photoresist fabrication |
| 7.5.27. |
Photoresist approach |
| 7.5.27. |
Photoresist approach |
| 7.5.28. |
Successive patterning of red and green QD of various sizes |
| 7.5.28. |
Successive patterning of red and green QD of various sizes |
| 7.5.29. |
QD photoresist |
| 7.5.29. |
QD photoresist |
| 7.5.30. |
Quantum-dots colour conversion layer |
| 7.5.30. |
Quantum-dots colour conversion layer |
| 7.5.31. |
Full-colour emission of quantum-dot-based micro LED display by aerosol jet technology |
| 7.5.31. |
Full-colour emission of quantum-dot-based micro LED display by aerosol jet technology |
| 7.5.32. |
Electrohydrodynamic jet printing 1 |
| 7.5.32. |
Electrohydrodynamic jet printing 1 |
| 7.5.33. |
Electrohydrodynamic jet printing 2 |
| 7.5.33. |
Electrohydrodynamic jet printing 2 |
| 7.5.34. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 1 |
| 7.5.34. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 1 |
| 7.5.35. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 2 |
| 7.5.35. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 2 |
| 7.5.36. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 3 |
| 7.5.36. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 3 |
| 7.5.37. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 4 |
| 7.5.37. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 4 |
| 7.5.38. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 5 |
| 7.5.38. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 5 |
| 7.5.39. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 6 |
| 7.5.39. |
Taiwan Nanocrystals: photo-patternable QDs for µLED displays 6 |
| 7.6. |
Quantum well approach |
| 7.6. |
Quantum well approach |
| 7.6.1. |
Quantum wells |
| 7.6.1. |
Quantum wells |
| 7.6.2. |
Conclusions |
| 7.6.2. |
Conclusions |
| 8. |
LIGHT MANAGEMENT |
| 8. |
LIGHT MANAGEMENT |
| 8.1. |
Light management approach summary |
| 8.1. |
Light management approach summary |
| 8.2. |
Layers to optimize current distribution for better light extraction |
| 8.2. |
Layers to optimize current distribution for better light extraction |
| 8.3. |
InfiniLED’s approach to increase light extraction efficiency 1 |
| 8.3. |
InfiniLED’s approach to increase light extraction efficiency 1 |
| 8.4. |
InfiniLED’s approach to increase light extraction efficiency 2 |
| 8.4. |
InfiniLED’s approach to increase light extraction efficiency 2 |
| 8.5. |
Methods to capture light output |
| 8.5. |
Methods to capture light output |
| 8.6. |
Micro-catadioptric optical array for better directionality |
| 8.6. |
Micro-catadioptric optical array for better directionality |
| 9. |
BACKPLANES AND DRIVING |
| 9. |
BACKPLANES AND DRIVING |
| 9.1. |
Backplane and driving options for Micro-LED displays |
| 9.1. |
Backplane and driving options for Micro-LED displays |
| 9.2. |
Introduction to metal oxide semiconductor field-effect transistors |
| 9.2. |
Introduction to metal oxide semiconductor field-effect transistors |
| 9.3. |
Introduction to thin film transistors |
| 9.3. |
Introduction to thin film transistors |
| 9.4. |
Introduction to complementary metal oxide semiconductor |
| 9.4. |
Introduction to complementary metal oxide semiconductor |
| 9.5. |
Introduction to backplane |
| 9.5. |
Introduction to backplane |
| 9.6. |
TFT materials |
| 9.6. |
TFT materials |
| 9.7. |
Pixel driving for OLED |
| 9.7. |
Pixel driving for OLED |
| 9.8. |
LCD pixel structure |
| 9.8. |
LCD pixel structure |
| 9.9. |
TFT backplane |
| 9.9. |
TFT backplane |
| 9.10. |
Passive matrix addressing |
| 9.10. |
Passive matrix addressing |
| 9.11. |
Passive driving structure |
| 9.11. |
Passive driving structure |
| 9.12. |
Active matrix addressing |
| 9.12. |
Active matrix addressing |
| 9.13. |
Comparison between PM and AM addressing |
| 9.13. |
Comparison between PM and AM addressing |
| 9.14. |
Transistor-micro-LED connection design |
| 9.14. |
Transistor-micro-LED connection design |
| 9.15. |
Driving for micro-LEDs |
| 9.15. |
Driving for micro-LEDs |
| 9.16. |
Pulse width modulation |
| 9.16. |
Pulse width modulation |
| 9.17. |
PAM vs. PWM |
| 9.17. |
PAM vs. PWM |
| 9.18. |
Driving voltage |
| 9.18. |
Driving voltage |
| 9.19. |
Driving vs. EQE |
| 9.19. |
Driving vs. EQE |
| 9.20. |
RGB driver |
| 9.20. |
RGB driver |
| 9.21. |
Active matrix micro-LEDs with LTPS TFT backplane |
| 9.21. |
Active matrix micro-LEDs with LTPS TFT backplane |
| 9.22. |
Conclusion |
| 9.22. |
Conclusion |
| 10. |
IMAGE QUALITY IMPROVEMENT, POWER CONSUMPTION REDUCTION AND OTHER DESIGNS |
| 10. |
IMAGE QUALITY IMPROVEMENT, POWER CONSUMPTION REDUCTION AND OTHER DESIGNS |
| 10.1. |
Image Quality Improvement |
| 10.1. |
Image Quality Improvement |
| 10.1.1. |
TFT-based image uniformity issues |
| 10.1.1. |
TFT-based image uniformity issues |
| 10.1.2. |
LED binning |
| 10.1.2. |
LED binning |
| 10.1.3. |
Drive design |
| 10.1.3. |
Drive design |
| 10.1.4. |
Optical compensation |
| 10.1.4. |
Optical compensation |
| 10.1.5. |
Drive compensation |
| 10.1.5. |
Drive compensation |
| 10.2. |
Power Consumption Reduction |
| 10.2. |
Power Consumption Reduction |
| 10.2.1. |
LED and TFT |
| 10.2.1. |
LED and TFT |
| 10.2.2. |
Drive mode optimization |
| 10.2.2. |
Drive mode optimization |
| 10.2.3. |
Backplane optimization |
| 10.2.3. |
Backplane optimization |
| 11. |
MINI-LED DISPLAYS |
| 11. |
MINI-LED DISPLAYS |
| 11.1. |
Mini-LED display configurations |
| 11.1. |
Mini-LED display configurations |
| 11.2. |
What kind of role is mini-LED playing? |
| 11.2. |
What kind of role is mini-LED playing? |
| 11.3. |
MiniLEDs, real hope for 2021 onward? |
| 11.3. |
MiniLEDs, real hope for 2021 onward? |
| 11.4. |
Trends of Mini-LED displays |
| 11.4. |
Trends of Mini-LED displays |
| 12. |
COST ANALYSIS |
| 12. |
COST ANALYSIS |
| 12.1. |
Cost basics |
| 12.1. |
Cost basics |
| 12.2. |
Micro-LED cost vs. Die size |
| 12.2. |
Micro-LED cost vs. Die size |
| 12.3. |
Cost assumption |
| 12.3. |
Cost assumption |
| 12.4. |
Cost analysis |
| 12.4. |
Cost analysis |
| 12.5. |
Economics of micro-LED: cost down paths |
| 12.5. |
Economics of micro-LED: cost down paths |
| 13. |
MARKET ANALYSIS |
| 13. |
MARKET ANALYSIS |
| 13.1. |
Forecast approaches and assumptions |
| 13.1. |
Forecast approaches and assumptions |
| 13.2. |
Market forecast of shipment unit |
| 13.2. |
Market forecast of shipment unit |
| 13.3. |
2026 & 2031 application market share |
| 13.3. |
2026 & 2031 application market share |
| 13.4. |
Market forecast analysis |
| 13.4. |
Market forecast analysis |
| 13.5. |
Wafer value forecast |
| 13.5. |
Wafer value forecast |
| 14. |
PARTNERSHIPS, MERGES, ACQUISITIONS AND JOINT VENTURE |
| 14. |
PARTNERSHIPS, MERGES, ACQUISITIONS AND JOINT VENTURE |
| 14.1. |
Display cycle |
| 14.1. |
Display cycle |
| 14.2. |
Benefits |
| 14.2. |
Benefits |
| 14.3. |
Epistar & Leyard |
| 14.3. |
Epistar & Leyard |
| 14.4. |
PlayNitride & RIT Display |
| 14.4. |
PlayNitride & RIT Display |
| 14.5. |
Konka & Chongqing Liangshan Industrial Investment, Konka & LianTronics |
| 14.5. |
Konka & Chongqing Liangshan Industrial Investment, Konka & LianTronics |
| 14.6. |
BOE & Rohinni |
| 14.6. |
BOE & Rohinni |
| 14.7. |
Lextar & X Display |
| 14.7. |
Lextar & X Display |
| 14.8. |
JDI & glō, Kyocera & glō |
| 14.8. |
JDI & glō, Kyocera & glō |
| 14.9. |
Seoul Semiconductors & Viosys |
| 14.9. |
Seoul Semiconductors & Viosys |
| 14.10. |
Kulicke & Soffa and Uniqarta |
| 14.10. |
Kulicke & Soffa and Uniqarta |
| 15. |
PLAYERS AND CASE STUDIES |
| 15. |
PLAYERS AND CASE STUDIES |
| 15.1.1. |
Players discussed in this report |
| 15.1.1. |
Players discussed in this report |
| 15.2. |
Aledia |
| 15.2. |
Aledia |
| 15.2.1. |
Aledia: introduction |
| 15.2.1. |
Aledia: introduction |
| 15.2.2. |
Scalability to larger silicon substrate |
| 15.2.2. |
Scalability to larger silicon substrate |
| 15.2.3. |
Aledia’s quasi-fabless business model |
| 15.2.3. |
Aledia’s quasi-fabless business model |
| 15.2.4. |
Integration process of Aledia’s WireLED display |
| 15.2.4. |
Integration process of Aledia’s WireLED display |
| 15.2.5. |
Wafer uniformity of nanowires |
| 15.2.5. |
Wafer uniformity of nanowires |
| 15.2.6. |
Colour conversion of WireLEDs |
| 15.2.6. |
Colour conversion of WireLEDs |
| 15.2.7. |
Interconnection options |
| 15.2.7. |
Interconnection options |
| 15.2.8. |
Aledia’s display modules |
| 15.2.8. |
Aledia’s display modules |
| 15.3. |
ALLOS Semiconductors |
| 15.3. |
ALLOS Semiconductors |
| 15.3.1. |
ALLOS Semiconductors: introduction |
| 15.3.1. |
ALLOS Semiconductors: introduction |
| 15.3.2. |
Strain management and emission uniformity 1 |
| 15.3.2. |
Strain management and emission uniformity 1 |
| 15.3.3. |
Strain management and emission uniformity 2 |
| 15.3.3. |
Strain management and emission uniformity 2 |
| 15.3.4. |
Strain management |
| 15.3.4. |
Strain management |
| 15.3.5. |
Aoto Electronics |
| 15.3.5. |
Aoto Electronics |
| 15.4. |
Apple |
| 15.4. |
Apple |
| 15.4.1. |
Apple |
| 15.4.1. |
Apple |
| 15.4.2. |
Apple’s new Micro-LED chiplet architecture 1 |
| 15.4.2. |
Apple’s new Micro-LED chiplet architecture 1 |
| 15.4.3. |
Apple’s new Micro-LED chiplet architecture 2 |
| 15.4.3. |
Apple’s new Micro-LED chiplet architecture 2 |
| 15.4.4. |
AU Optronics |
| 15.4.4. |
AU Optronics |
| 15.5. |
AU Optronics |
| 15.5. |
AU Optronics |
| 15.5.1. |
AUO’s LTPS TFT driven micro-LED display 1 |
| 15.5.1. |
AUO’s LTPS TFT driven micro-LED display 1 |
| 15.5.2. |
AUO’s LTPS TFT driven micro-LED display 2 |
| 15.5.2. |
AUO’s LTPS TFT driven micro-LED display 2 |
| 15.6. |
BOE |
| 15.6. |
BOE |
| 15.6.1. |
Speeding up towards mini- and micro-LED displays |
| 15.6.1. |
Speeding up towards mini- and micro-LED displays |
| 15.6.2. |
BOE mini LED Backlight |
| 15.6.2. |
BOE mini LED Backlight |
| 15.6.3. |
BOE Mini LED Display |
| 15.6.3. |
BOE Mini LED Display |
| 15.7. |
CEA-Leti |
| 15.7. |
CEA-Leti |
| 15.7.1. |
CEA-Leti: introduction |
| 15.7.1. |
CEA-Leti: introduction |
| 15.7.2. |
Demos by hybridization technology |
| 15.7.2. |
Demos by hybridization technology |
| 15.7.3. |
Display performance |
| 15.7.3. |
Display performance |
| 15.7.4. |
Process of fabricating hybridization micro-displays |
| 15.7.4. |
Process of fabricating hybridization micro-displays |
| 15.7.5. |
Process of fabricating monolithic micro-displays |
| 15.7.5. |
Process of fabricating monolithic micro-displays |
| 15.7.6. |
Novel approach for monolithic display fabrication |
| 15.7.6. |
Novel approach for monolithic display fabrication |
| 15.8. |
Chengdu Vistar Optoelectronics |
| 15.8. |
Chengdu Vistar Optoelectronics |
| 15.8.1. |
Chengdu Vistar Optoelectronics |
| 15.8.1. |
Chengdu Vistar Optoelectronics |
| 15.9. |
EpiPix |
| 15.9. |
EpiPix |
| 15.9.1. |
Introduction of EpiPix |
| 15.9.1. |
Introduction of EpiPix |
| 15.9.2. |
EpiPix’s technique |
| 15.9.2. |
EpiPix’s technique |
| 15.10. |
glō |
| 15.10. |
glō |
| 15.10.1. |
Introduction of glō |
| 15.10.1. |
Introduction of glō |
| 15.10.2. |
Glō’s technology |
| 15.10.2. |
Glō’s technology |
| 15.10.3. |
Glō’s prototypes |
| 15.10.3. |
Glō’s prototypes |
| 15.11. |
ITRI |
| 15.11. |
ITRI |
| 15.11.1. |
ITRI development of micro-LEDs |
| 15.11.1. |
ITRI development of micro-LEDs |
| 15.11.2. |
ITRI’s progress |
| 15.11.2. |
ITRI’s progress |
| 15.11.3. |
ITRI’s offering |
| 15.11.3. |
ITRI’s offering |
| 15.11.4. |
Micro-LED device characteristics |
| 15.11.4. |
Micro-LED device characteristics |
| 15.11.5. |
Reliability test |
| 15.11.5. |
Reliability test |
| 15.11.6. |
ITRI’s MicroLED displays |
| 15.11.6. |
ITRI’s MicroLED displays |
| 15.11.7. |
ITRI’s transparent MicroLED displays |
| 15.11.7. |
ITRI’s transparent MicroLED displays |
| 15.11.8. |
ITRI |
| 15.11.8. |
ITRI |
| 15.12. |
Jade Bird Display |
| 15.12. |
Jade Bird Display |
| 15.12.1. |
Jade Bird Display: introduction |
| 15.12.1. |
Jade Bird Display: introduction |
| 15.12.2. |
Existing hybrid integration technology by flip chip technique |
| 15.12.2. |
Existing hybrid integration technology by flip chip technique |
| 15.12.3. |
Device fabrication 1 |
| 15.12.3. |
Device fabrication 1 |
| 15.12.4. |
Device fabrication 2 |
| 15.12.4. |
Device fabrication 2 |
| 15.12.5. |
Device structure and architecture |
| 15.12.5. |
Device structure and architecture |
| 15.12.6. |
micro-LEDs for the JBD’s micro-displays |
| 15.12.6. |
micro-LEDs for the JBD’s micro-displays |
| 15.12.7. |
JBD’s monochromatic AM micro-LED micro-displays |
| 15.12.7. |
JBD’s monochromatic AM micro-LED micro-displays |
| 15.12.8. |
AM micro-LED with directional emission |
| 15.12.8. |
AM micro-LED with directional emission |
| 15.12.9. |
Application: 3 colour LED projector |
| 15.12.9. |
Application: 3 colour LED projector |
| 15.12.10. |
High PPI AM micro-LED micro-display |
| 15.12.10. |
High PPI AM micro-LED micro-display |
| 15.12.11. |
AM micro-LED chips |
| 15.12.11. |
AM micro-LED chips |
| 15.12.12. |
Prototype for AR/VR |
| 15.12.12. |
Prototype for AR/VR |
| 15.13. |
Japan Display Inc. (JDI) |
| 15.13. |
Japan Display Inc. (JDI) |
| 15.13.1. |
JDI’s prototype |
| 15.13.1. |
JDI’s prototype |
| 15.14. |
Konka |
| 15.14. |
Konka |
| 15.14.1. |
Konka’s efforts on Micro-LED displays |
| 15.14.1. |
Konka’s efforts on Micro-LED displays |
| 15.14.2. |
Konka’s smart watch |
| 15.14.2. |
Konka’s smart watch |
| 15.15. |
Kyocera |
| 15.15. |
Kyocera |
| 15.15.1. |
Kyocera: high PPI micro-LED display |
| 15.15.1. |
Kyocera: high PPI micro-LED display |
| 15.15.2. |
Kyocera: display design |
| 15.15.2. |
Kyocera: display design |
| 15.16. |
LG |
| 15.16. |
LG |
| 15.16.1. |
Micro LED Signage |
| 15.16.1. |
Micro LED Signage |
| 15.17. |
Lumens |
| 15.17. |
Lumens |
| 15.17.1. |
Lumens’ micro-LED displays |
| 15.17.1. |
Lumens’ micro-LED displays |
| 15.17.2. |
Lumen’s prototypes |
| 15.17.2. |
Lumen’s prototypes |
| 15.18. |
Lumiode |
| 15.18. |
Lumiode |
| 15.18.1. |
Lumiode: introduction |
| 15.18.1. |
Lumiode: introduction |
| 15.18.2. |
Lumiode approach, process details |
| 15.18.2. |
Lumiode approach, process details |
| 15.18.3. |
Lumiode’s micro-LED performance |
| 15.18.3. |
Lumiode’s micro-LED performance |
| 15.18.4. |
Lumiode’s device performance |
| 15.18.4. |
Lumiode’s device performance |
| 15.19. |
Micro Nitride |
| 15.19. |
Micro Nitride |
| 15.19.1. |
Micro Nitride: Introduction |
| 15.19.1. |
Micro Nitride: Introduction |
| 15.19.2. |
Micro Nitride’s technology 1 |
| 15.19.2. |
Micro Nitride’s technology 1 |
| 15.19.3. |
Micro Nitride’s technology 2 |
| 15.19.3. |
Micro Nitride’s technology 2 |
| 15.20. |
Mikro Mesa |
| 15.20. |
Mikro Mesa |
| 15.20.1. |
About Mikro Mesa |
| 15.20.1. |
About Mikro Mesa |
| 15.20.2. |
Mikro Mesa’s micro-LEDs |
| 15.20.2. |
Mikro Mesa’s micro-LEDs |
| 15.20.3. |
Mikro Mesa: Current injection |
| 15.20.3. |
Mikro Mesa: Current injection |
| 15.21. |
Nanjing CEC Panda FPD Technology |
| 15.21. |
Nanjing CEC Panda FPD Technology |
| 15.21.1. |
Introduction of CEC Panda |
| 15.21.1. |
Introduction of CEC Panda |
| 15.21.2. |
Micro-LED and oxide development of Panda |
| 15.21.2. |
Micro-LED and oxide development of Panda |
| 15.22. |
Plessey |
| 15.22. |
Plessey |
| 15.22.1. |
Plessey: GaN-on-Silicon |
| 15.22.1. |
Plessey: GaN-on-Silicon |
| 15.22.2. |
Plessey’s display development roadmap |
| 15.22.2. |
Plessey’s display development roadmap |
| 15.22.3. |
LED manufacturing |
| 15.22.3. |
LED manufacturing |
| 15.22.4. |
Pixel development |
| 15.22.4. |
Pixel development |
| 15.22.5. |
RGB GaN on silicon |
| 15.22.5. |
RGB GaN on silicon |
| 15.22.6. |
Plessey’s core development |
| 15.22.6. |
Plessey’s core development |
| 15.22.7. |
Prototype |
| 15.22.7. |
Prototype |
| 15.23. |
PlayNitride |
| 15.23. |
PlayNitride |
| 15.23.1. |
PlayNitride: Introduction |
| 15.23.1. |
PlayNitride: Introduction |
| 15.23.2. |
Role of PlayNitride at micro-LED ecosystem |
| 15.23.2. |
Role of PlayNitride at micro-LED ecosystem |
| 15.23.3. |
PlayNitride timeline |
| 15.23.3. |
PlayNitride timeline |
| 15.23.4. |
PlayNitride’s application market |
| 15.23.4. |
PlayNitride’s application market |
| 15.23.5. |
PixeLED display structure |
| 15.23.5. |
PixeLED display structure |
| 15.23.6. |
PixeLED MatrixTM tiling display technology |
| 15.23.6. |
PixeLED MatrixTM tiling display technology |
| 15.23.7. |
PlayNitride: Prototypes 1 |
| 15.23.7. |
PlayNitride: Prototypes 1 |
| 15.23.8. |
PlayNitride : Prototypes 2 |
| 15.23.8. |
PlayNitride : Prototypes 2 |
| 15.23.9. |
PlayNitride : Prototypes 3 |
| 15.23.9. |
PlayNitride : Prototypes 3 |
| 15.23.10. |
PlayNitride: Prototypes 4 |
| 15.23.10. |
PlayNitride: Prototypes 4 |
| 15.23.11. |
PlayNitride: Prototypes 5 |
| 15.23.11. |
PlayNitride: Prototypes 5 |
| 15.24. |
Rohinni |
| 15.24. |
Rohinni |
| 15.24.1. |
Introduction of Rohinni |
| 15.24.1. |
Introduction of Rohinni |
| 15.24.2. |
Technology |
| 15.24.2. |
Technology |
| 15.24.3. |
Product benefits example |
| 15.24.3. |
Product benefits example |
| 15.25. |
Samsung |
| 15.25. |
Samsung |
| 15.25.1. |
Samsung left LCD business |
| 15.25.1. |
Samsung left LCD business |
| 15.25.2. |
The Wall vs. The Window |
| 15.25.2. |
The Wall vs. The Window |
| 15.25.3. |
LED Cinema Screen |
| 15.25.3. |
LED Cinema Screen |
| 15.25.4. |
Samsung’s MicroLED Home Screen at CES 2021 |
| 15.25.4. |
Samsung’s MicroLED Home Screen at CES 2021 |
| 15.25.5. |
Samsung’s QNED |
| 15.25.5. |
Samsung’s QNED |
| 15.25.6. |
Price of Samsung TVs |
| 15.25.6. |
Price of Samsung TVs |
| 15.25.7. |
RGB one chip |
| 15.25.7. |
RGB one chip |
| 15.26. |
Saphlux |
| 15.26. |
Saphlux |
| 15.26.1. |
Saphlux: introduction |
| 15.26.1. |
Saphlux: introduction |
| 15.26.2. |
NPQD technology |
| 15.26.2. |
NPQD technology |
| 15.27. |
Sharp |
| 15.27. |
Sharp |
| 15.27.1. |
Sharp: introduction |
| 15.27.1. |
Sharp: introduction |
| 15.27.2. |
Process flow of Silicon Display |
| 15.27.2. |
Process flow of Silicon Display |
| 15.27.3. |
Display driver |
| 15.27.3. |
Display driver |
| 15.27.4. |
Monolithic micro-LED array |
| 15.27.4. |
Monolithic micro-LED array |
| 15.27.5. |
Full colour realization |
| 15.27.5. |
Full colour realization |
| 15.27.6. |
Prototypes made by Sharp |
| 15.27.6. |
Prototypes made by Sharp |
| 15.27.7. |
New spin-off |
| 15.27.7. |
New spin-off |
| 15.28. |
Sony |
| 15.28. |
Sony |
| 15.28.1. |
Sony: initial efforts |
| 15.28.1. |
Sony: initial efforts |
| 15.28.2. |
Sony: scalable display system |
| 15.28.2. |
Sony: scalable display system |
| 15.28.3. |
Sony: precise tiling 1 |
| 15.28.3. |
Sony: precise tiling 1 |
| 15.28.4. |
Sony: precise tiling 2 |
| 15.28.4. |
Sony: precise tiling 2 |
| 15.28.5. |
Sony: micro-LEDs |
| 15.28.5. |
Sony: micro-LEDs |
| 15.28.6. |
Sony: viewing angle advantages |
| 15.28.6. |
Sony: viewing angle advantages |
| 15.28.7. |
Sony: active matrix driving with micro IC |
| 15.28.7. |
Sony: active matrix driving with micro IC |
| 15.28.8. |
Sony: HDR reproducibility |
| 15.28.8. |
Sony: HDR reproducibility |
| 15.28.9. |
Sony: business strategy |
| 15.28.9. |
Sony: business strategy |
| 15.29. |
Stan (Shenzhen) Technology |
| 15.29. |
Stan (Shenzhen) Technology |
| 15.29.1. |
Stan Technology |
| 15.29.1. |
Stan Technology |
| 15.30. |
TCL/CSOT |
| 15.30. |
TCL/CSOT |
| 15.30.1. |
The Cinema Wall |
| 15.30.1. |
The Cinema Wall |
| 15.30.2. |
TFT backplane-based micro-LED displays |
| 15.30.2. |
TFT backplane-based micro-LED displays |
| 15.30.3. |
TCL CSOT Mini LED roadmap |
| 15.30.3. |
TCL CSOT Mini LED roadmap |
| 15.31. |
Visionox |
| 15.31. |
Visionox |
| 15.31.1. |
Visionox’s planning |
| 15.31.1. |
Visionox’s planning |
| 15.32. |
VueReal |
| 15.32. |
VueReal |
| 15.33. |
VueReal: introduction |
| 15.33. |
VueReal: introduction |
| 15.34. |
VueReal: high efficient micro-LEDs |
| 15.34. |
VueReal: high efficient micro-LEDs |
| 15.35. |
VueReal: Inspection |
| 15.35. |
VueReal: Inspection |
| 15.36. |
VueReal: curing |
| 15.36. |
VueReal: curing |
| 15.37. |
VueReal: prototypes |
| 15.37. |
VueReal: prototypes |
| 16. |
APPENDIX |
| 16. |
APPENDIX |
| 16.1. |
Colours and pixels |
| 16.1. |
Colours and pixels |
| 16.2. |
What is resolution? |
| 16.2. |
What is resolution? |
| 16.3. |
Pixel pitch and fill factor |
| 16.3. |
Pixel pitch and fill factor |
| 16.4. |
EQE and IQE |
| 16.4. |
EQE and IQE |
| 16.5. |
3D colour volume |
| 16.5. |
3D colour volume |
| 16.6. |
LCD panel structure |
| 16.6. |
LCD panel structure |
| 16.7. |
Active matrix-LCD structure |
| 16.7. |
Active matrix-LCD structure |
